Global
Advanced Semiconductor Packaging Market was valued US$ XX Bn in 2018 and is
expected to reach US$ XX Bn by 2026, at a CAGR of around 11.3% during a
forecast period.
Advanced semiconductor packaging prevents physical damage
and corrosion of the chips that are to be connected to the circuit boards. In
the recent years, semiconductor packaging has evolved giving increase to
advanced semiconductor packaging technologies.
Advanced semiconductor packaging market report studied,
analyzed and presented the major trends that will impact the industry and
competitive landscape of the advanced semiconductor packaging market. The
latest key trend gaining momentum in the market is changing in wafer size. The
rapid technological advancements in wafer processing have always been a vital
challenge faced by a vendor and are hindering the growth of the global market
for advanced semiconductor packaging. The industry is focusing on producing
larger diameter wafers which in turn are likely to cut down the manufacturing
costs.
The report on global advanced semiconductor packaging market
covers segments such as packaging type, application and region. Based on the
packaging type, the flip-chip packaging technology segment accounted for the
major XX% shares of the semiconductor advanced packaging market. Factors such
as the expanding shipment of mobile devices and the high adoption of 2.5D/3D
ICs in almost all electronic devices will contribute to the growth of this
industry segment in the upcoming years.
Region-wise, The APAC is projected to witness the fastest
growth during the forecast period. Likewise, such growth can be attributed to
the presence of prominent semiconductor manufacturing companies present in the
region which are driving the demand for advanced semiconductor packaging.
Moreover, companies are also seen investing heavily in the R&D of new
semiconductor packages with advanced features.
Indian Government has deployed enterprises such as
Preferential Market Access (PMS), Electronics Manufacturing Clusters (EMC), and
Modified Special Incentive Package Scheme (M-SIPS) in order to achieve a degree
of sufficiency in electronics, which will push the advanced semiconductors
packaging market beyond restrictions, as semiconductor devices are one of the
main components of electronic gadgets.
In 2013, ASE group, a supplier of independent semiconductor
manufacturing services in testing and assembly, hit a roadblock. Various claimed
that ASE disposed wastewater with high acidity levels in a water body near the
NEPZ, where it runs 12 facilities, and therefore received 48 environmental
penalties. However, in 2016, the Kaohsiung High Administrative Court revoked
penalties forced by the Kaohsiung City Government’s Environmental Protection
Bureau. Since then, ASE invested millions to recycle wastewater from its
Kaohsiung operations and made the water-recycling plant. The company further
installed ultra-efficient lighting & heating, ventilation and
air-conditioning systems and received the 2016 (AREA) Asia Responsible
Entrepreneurship Award in the Social Empowerment category.
The reports cover detail key developments in the advanced
semiconductor packaging market as organic and inorganic growth strategies. Many
companies are focusing on organic growth strategies such as product launches,
product approvals and others like patents and events. Inorganic growth
strategies activities witnessed in the advanced semiconductor packaging market were
acquisitions and partnership & collaborations.
The objective of the report is to present a comprehensive
assessment of the market and contains thoughtful insights, facts, historical
data, industry-validated market data and projections with a suitable set of
assumptions and methodology. The report also helps in understanding Global
Advanced Semiconductor Packaging Market dynamics, structure by identifying and
analyzing the market segments and project the global market size. Further, the
report also focuses on the competitive analysis of key players by product,
price, financial position, product portfolio, growth strategies, and regional
presence. The report also provides PEST analysis, PORTER’s analysis, and SWOT
analysis to address the question of shareholders to prioritizing the efforts
and investment shortly to the emerging segment in the Global Advanced
Semiconductor Packaging Market.
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Scope of the Global Advanced Semiconductor Packaging Market
Global Advanced Semiconductor Packaging Market, by Packaging
Type
• FO WLP
• 2.5D/3D
• FI WLP
• Flip Chip
Global Advanced Semiconductor Packaging Market, by Application
• Automotive
• Aerospace and Defense
• Medical Devices
• Consumer Electronics
• Other
Global Advanced Semiconductor Packaging Market, by Region
• North America
• Europe
• Asia Pacific
• Middle East & Africa
• South America
Key players operating in the Global Advanced Semiconductor
Packaging Market
• AMD
• Intel Corp
• Amkor Technology
• STMicroelectronics
• Hitachi Chemical
• Infineon
• Avery Dennison
• Sumitomo Chemical
• ASE Group
• Kyocera
• China Wafer Level CSP
• ChipMOS TECHNOLOGIES
• FlipChip International
• HANA Micron
• Interconnect Systems (Molex)
• Jiangsu Changjiang Electronics Technology (JCET)
• King Yuan Electronics
• Tongfu Microelectronics
• Nepes
• Powertech Technology (PTI)
• SIGNETICS
• Tianshui Huatian
• Ultratech
• UTAC.
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the report:
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provides free personalized of reports as per your demand. This report can be
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will guarantee provide you to get a report that suits your necessities.
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